1. What's Technology Day? 

Technology Day 2010 is a free educational and networking event for friends and customers of Stork laboratories in California. The four Stork labs—Stork Garwood in Pico Rivera and San Clemente, and Stork Materials Testing & Inspection in Huntington Beach and Rancho Dominquez—are hosting the event, which will include a catered lunch, live seminars by Stork experts on everything from metallurgy to failure analysis to telecommunications testing, and a "happy hour" party.

2. Who's invited? 

All friends and customers of Stork Materials Technology are invited to attend.

3. When is it?

Friday, March 12, 2010

• Catered lunch: 11:00 a.m. - 1:00 p.m.
• Free technical seminars: 1:00  p.m. - 5:00 p.m.
• Happy Hour party: 5:00 p.m. - 7:00 p.m.

4. Where is it?

Lunch begins at Stork Materials Testing & Inspection, 18100 S Wilmington Ave, Rancho Dominguez, CA. Link to MapQuest map.

5. What's on the agenda?

The schedule is coming together; as of January 21, we have 10 technical workshops planned. Guests will be able to choose at least 3 seminars on topics that interest them, presented face-to-face by Stork experts, and with time for questions from attendees. In addition, live demonstrations of testing methods and specialized equipment will be going on around the laboratory.

Abstracts

• Introduction to Fracture Toughness Testing: This presentation will answer the following questions: What is Fracture Toughness? How do we test for it? What do we measure? And, what are the factors that affect the test (specimen size, sharpness of fatigue pre-crack, etc.)?
• Design Tips & Tricks for EMI Compliance: This presentation will cover some concepts to keep your next product from being considered for the "Unintentional Radar Design of the Year" award. We will show examples of eliminating antennae from your circuit boards and supposed Faraday cages, and we will examine clock terminations to understand the purpose and values of terminations. Also to be discussed is Electrostatic Discharge, and simple and economic protection methods; fast with almost zero capacitance for high frequency integrity.
• Ultrasonic Inspection Principles: A-Scan, B-Scan and/or C-Scan—what's the difference? Ultrasonic inspection is one the most widely used methods of nondestructive inspection. Its principle application is for the detection and characterization of internal flaws along with determination of the thickness as the sound is transmitted through the specimen. The display and classification principles are critical when determining the correct method of inspection to satisfy the customer’s requirements. We will discuss along with demonstrate the various methodologies and how each are utilized to meet current specifications.
• Indirect Lightning Strikes-DO-160, First Hand Demo: This presentation will cover Indirect Lightning Testing as found in DO-160, Section 22. We will show examples of the various tests, including Single Stroke, Multi Stroke, and Multi Burst. We will examine what these tests are, what it means, and how it applies to your equipment. 
• Computerized Radiography vs. Film: Digital Radiography is a mature technology and is clearly an alternative to film. The benefits of having an industrial radiographic process without the cost associated with film, photographic chemistry, environmental compliance and film storage are further enhanced by the ability to achieve the required results in less time, at lower doses of radiation, using digital archiving with the ability to network.
• ITAR Compliance: This presentation will discuss International Traffic In Arms, including real world examples, tips and techniques to maintain a compliant system on a budget, and protecting your organization, your customers and your employees.
• Pre-Penetrant Etch or Cleaning: Why is it required? Parts that have been mechanically processed prior to Liquid Penetrant Inspection should be evaluated to determine if flaw detectability has been compromised. If material smearing is a problem, an etching process can be used to remove the smeared material prior to inspection. Common coatings and contaminates that must be removed include: paint, dirt, flux, scale, varnish, oil, etchant, smut, plating, grease, oxide, wax, decals, machining fluid, rust, and residue from previous penetrant inspections. Some of these contaminants would obviously prevent penetrant from entering defects, so it is clear they must be removed. Specification requirements require this process before a penetrant inspection can be performed.
• PMI (Positive Material Identification) and Other Possibilities: This presentation will explain Positive Material Identification or PMI--what it means, its main uses, how it works, and other possibilities and potentials for your products and materials. The presentation will also include a demonstration.
• A Practical Guide to Failure Analysis: This presentation will provide a brief overview of the failure analysis process from a metallurgical / fractographic perspective. Various techniques and tools associated with failure analysis of metallic materials will be presented including brief case histories.
• Ultrasonic Inspection of Composites: Ultrasonic inspection of laminated composites, bonded laminates, and adhesively bonded honeycomb composite structures produces excellent results. Reflections and attenuations from delaminations can be distinguished from void areas, areas of porosity and disbonds. Results can be displayed in a variety of formats that will be demonstrated during this session.
• CE Mark and your Products: The Low Voltage, EMC, and Machinery Directives have recently undergone changes and now have new rules designator numbers. The Medical Device Directive has a new designator and significant new rules and requirements as of March 21, 2010. Chuck will provide an overview of the products requiring the CE Mark and what is done to create the proper documentation so you can apply the CE Mark to your product.

6. How do I register to attend?

Fill out this form to register. If you have further questions, contact Andrea Conklin at andrea.conklin@us.stork.com.

7. Can I attend more than one seminar? 

Yes, you can attend up to 3 during the course of the day.

8. Is there a charge for lunch or for the seminars?

No, the meal and the technical presentations are our way of thanking our customers and welcoming new guests to our laboratories.

9. Who is hosting Technology Day?

Technology Day 2010 will be hosted by the four Stork laboratories in California:

• Stork Garwood Laboratories in Pico Rivera and San Clemente
• Stork Materials Testing & Inspection laboratories in Huntington Beach and Rancho Dominguez

10. Why should I attend? 

All friends and customers of Stork are welcome to attend. Between the lunch, the seminars, the demonstrations, and our Happy Hour party, there will be something for everyone. (Adults only please)

11.  How many people can come from my company?

Everyone is welcome. Please call ahead to reserve seminar seats or contact Andrea Conklin at andrea.conklin@us.stork.com or call 310-632-8500. .

 12. What's for lunch?

This will be announced in January.

Register for Technology Day

Please fill out this form completely to make sure you have a space reserved for the seminars that interest you. We look forward to seeing you on March 12!